Editor profile
Senior Analyst, Supply Chain & Equipment
Marcus Lim focuses on the semiconductor upstream supply chain, from raw materials to advanced lithography equipment. He examines how international trade policies and logistics reshape global chip production.
marcus.lim@semiconreport.orgIn-depth analysis of the strategic significance of TSMC's capacity expansion for 3nm and 2nm advanced processes. This article will provide comprehensive investment and industry insights from multiple dimensions, including technological route competition, industry chain impact, geopolitical risks, and future five-year market landscape changes.
In-depth analysis of how advanced packaging technology for AI chips drives market growth and reshapes the competitive landscape of the entire industry chain from EDA to testing, exploring the profound impact of 2nm/3nm processes and AI infrastructure on the supply chain.
In-depth analysis of the driving factors of the global wafer foundry service market, from AI, HPC, and EV demand to advanced process competition, and dissecting the landscape changes of giants like TSMC, Samsung, and Intel.
In-depth analysis of the disruptive impact of AI on the semiconductor industry, covering advanced process competition, advanced packaging technology, key supply chain reshaping, geopolitical influence, and global market trends.
In-depth analysis of the Southeast Asian semiconductor market (2026-2034 forecast), exploring the market drivers from silicon carbide and AI infrastructure, key technological trends, and supply chain reshaping under geopolitical conditions.
In-depth analysis of how TSMC is responding to the massive demand from AI for high-performance computing (HPC) through 2nm/3nm processes, advanced packaging (CoWoS), and global capacity expansion, exploring the profound impact on the industry chain, technological roadmap, and regional landscape.
In-depth analysis of the 2026 semiconductor industry financing trends, revealing how capital flows are shifting from early exploration to infrastructure areas such as AI chips, advanced packaging, and leading-edge processes, and exploring the profound changes in the industry chain, technological roadmaps, and regional competitive landscapes.
In-depth analysis of the disruptive impact of AI on semiconductor manufacturing, focusing on advanced processes (2nm/3nm), GAA architecture, advanced packaging technology, and the competitive landscape and geopolitical implications in key areas such as ASML and EDA.
In-depth analysis of the structural shifts in current global semiconductor capital expenditure, focusing on the drivers of AI chips for advanced processes (2nm/3nm) and advanced packaging, as well as the trends and risks of supply chain restructuring under the geopolitical context.
In-depth analysis of how geopolitical constraints are reshaping the global semiconductor supply chain, covering the impact on the industry chain from AI chips and advanced processes to advanced packaging, the evolution of technological roadmaps, regional competitive landscapes, and future investment perspectives, providing professional analysis.
In-depth analysis of the structure, driving forces, and future trends of the global semiconductor design IP market. Explore the impact of AI integration and advanced process nodes on IP demand, and gain insights into the future direction of the semiconductor industry from the perspectives of the industry chain, competitive landscape, and regional influence.
Market research firm market.us forecasts that the global semiconductor market will grow from $662.6 billion in 2025 to approximately $1.5939 trillion by 2035, with a CAGR of 9.1%. This article analyzes the real implications of this growth curve for the global industrial chain from the perspectives of process node stratification, advanced packaging, HBM, power semiconductors, and regional division of labor.
Frequency and orbital slot applications for 203,000 low-orbit satellites and SpaceX's ~$1.5 trillion IPO preparations are driving RF chips into a new cycle. From the perspectives of the industry chain and technology roadmaps, this article analyzes how low-orbit constellations will reshape the landscape of the top five RF front-end players, why three-dimensional heterogeneous integration has become the core technological direction, and where various global regions stand competitively in the RF supply chain.
The latest report from Yole Group shows that the global semiconductor device market will reach $743 billion in 2025, with U.S. companies maintaining their dominance at a 56% share; China's capacity expansion and rising equipment self-sufficiency rate are shaping a new competitive landscape. This article provides an in-depth analysis from the perspectives of the industry chain, technology roadmaps, and geopolitical competition.
Based on Deloitte's 2026 Global Semiconductor Industry Outlook, this analyzes changes in AI demand, advanced process nodes, global supply chain, and the competitive landscape, providing a reference for decision-making in the chip industry.
AI demand is spreading from GPUs and HBM to peripheral components, triggering price increases and extended lead times for DRAM, PMIC, passive components, and even FR-4 PCB materials. This article analyzes the transmission mechanism, industrial chain impact, and long-term trends of this round of supply chain shocks.
Analyzing the distribution, technology nodes, and investment layouts of the world's 10 most advanced wafer fabs, examining the three-way competition among TSMC, Samsung, and Intel from an industry chain perspective, as well as the impact of advanced processes such as 2nm and GAA on supply chains, regional dynamics, and long-term investment.
SIA seminar focuses on the global power semiconductor ecosystem. This newspaper provides in-depth analysis from the perspectives of technology, supply chain, competition, and regional landscape.
Deloitte predicts global semiconductor sales will reach $975 billion by 2026, with AI chips contributing nearly half of the revenue but accounting for less than 0.2% of shipments. This article analyzes the impact of this structural imbalance on technology roadmaps, supply chains, competitive dynamics, and long-term investment.
Based on the StartUs Insights report "Electronics Manufacturing Trends 2026," this provides an in-depth analysis of the impact of ten major trends on the global semiconductor industry chain, including the 300mm wafer fab equipment investment cycle, wide-bandgap power devices, advanced packaging and Chiplet, smart manufacturing, and supply chain digitalization, covering technology roadmaps, competitive landscape, regional layout, and investment perspectives.