Fab tracker
Reporting on wafer fabs, foundry capacity, process nodes, yield progress, equipment adoption, fab construction and manufacturing partnerships.
TSMC will add two advanced packaging factories in the Chiayi Science Park to cope with the explosive demand for AI chips. This article analyzes the far-reaching significance of this expansion for the semiconductor industry from the perspectives of technology roadmap, supply chain, competitive landscape, and regional impact.
Based on the latest IndexBox report, an in-depth analysis of the North American semiconductor materials market size, growth drivers, supply chain dependencies, and competitive landscape, exploring industry opportunities under the CHIPS Act and geopolitics.
In-depth analysis of Intel's 18A process technology advantages, capacity bottlenecks, and its potential impact on TSMC's global foundry landscape.
SK Hynix, leveraging the success of its HBM chips in the AI field, has surpassed Samsung Electronics in market capitalization for the first time, becoming the most valuable listed company in South Korea. This article provides an in-depth analysis of the industrial significance of this milestone from the perspectives of the supply chain, technology roadmap, market competition, and supply chain.
Google is discussing with Samsung to produce the I/O Die for its tenth-generation AI chip "Icefish," using Samsung's 2nm process, while the main compute chip will still be manufactured by TSMC's 1.4nm process. This move marks a shift in the AI chip supply chain from sole reliance on TSMC to diversification, having a profound impact on the wafer foundry landscape, advanced packaging technology, and global semiconductor industry competition.
Taiwan's green energy industry has undergone more than two decades of development, with its strategic focus shifting from hardware manufacturing to industrial resilience and financial discipline. This transformation has a profound impact on the semiconductor wafer foundry and advanced packaging supply chains that are highly dependent on green electricity. Companies such as TSMC and UMC face new challenges in the stability and cost of energy supply.
NVIDIA and TSMC announced that they will apply NVIDIA’s accelerated computing, CUDA-X, cuLitho, cuEST, cuML, Metropolis, TAO, and Omniverse to wafer fabrication and yield optimization. This is not only a corporate partnership, but also reflects how advanced process nodes, advanced packaging, and fab operations are entering the “AI-native manufacturing” stage, and will reshape semiconductor equipment, software, yield management, and the way the industry supply chain competes.