Editor profile
Director, Market Watch & Research
Sofia Al-Said provides data-driven insights into the semiconductor market cycle and capital investment trends. She coordinates the publication of industry research and monitors major global chip summits.
sofia.al-said@semiconreport.orgThe global memory chip market is projected to reach $739 billion by 2035, with AI infrastructure and automotive electronics serving as core growth engines. This article provides an in-depth analysis from the perspectives of the industry chain, technology roadmaps, and competitive landscape.
Deloitte forecasts that global semiconductor sales will reach $975 billion by 2026, with AI chips contributing nearly half of the revenue yet accounting for only 0.2% of shipments. This article analyzes the profound impact of this imbalance on the industry chain, competitive landscape, and investment logic.
Deloitte predicts that new bottlenecks will emerge in the semiconductor supply chain by 2026: key technologies such as EDA tools, GAA transistors, and etching equipment are becoming the focus of export controls. This article analyzes the far-reaching impact of these changes on the global semiconductor industry from the perspectives of the industry chain, technology roadmaps, and competitive landscape.
In 2025, the global semiconductor industry is ushering in a new wave of wafer fab and facility investment driven by AI demand and geopolitical factors. Based on SemiEngineering's annual report, this article provides an in-depth analysis of the underlying logic and future impact of this global capacity migration from the perspectives of the industry chain, technology roadmap, regional competition, and investment.
Deloitte forecasts that global semiconductor sales will reach $975 billion in 2026, with AI chips contributing nearly half of the revenue while accounting for only 0.2% of shipment volume. This article analyzes the deep impact of the high-margin, low-volume model on the supply chain, technology routes, and competitive landscape.
Based on SemiEngineering's Annual Global IC Wafer Fab and Facilities Report, this article provides an in-depth analysis of the impact of the 2025 global semiconductor facility investment boom on the industry chain, technology roadmap, and competitive landscape.
Deloitte 2026 Global Semiconductor Industry Outlook Analysis: AI Chips, Advanced Manufacturing Processes, Supply Chain Restructuring, and Changes in Competitive Landscape.
AI is transforming the semiconductor industry on both the demand and supply sides. From data center AI accelerators to AI-driven chip design and manufacturing optimization, a market set to reach $90.5 billion will profoundly impact every segment of the global semiconductor industry chain. Based on the latest Fortune Business Insights report, this article analyzes AI's far-reaching influence on technology roadmaps, supply chains, competitive landscapes, and the regional industry landscape.
From CoWoS to CoPoS, how is advanced packaging technology evolving? This article provides an in-depth analysis of the technical advantages of panel-level packaging, TSMC's strategic layout, industry chain impacts, and the global competitive landscape.
In 2025, semiconductor companies announced over 170 investments in wafer fabs and facilities, driven by AI demand, geopolitical factors, and localization policies. This article analyzes their impact on the global semiconductor industry from the perspectives of the industrial chain, technology roadmaps, and competitive landscape.
Although Mexico does not produce advanced wafers, its semiconductor components market is expanding at a compound annual growth rate of 6-9%, driven by the transfer of back-end packaging and testing capacity through nearshoring. This article analyzes the profound impact of this niche market on the global semiconductor supply chain from the perspectives of industry chain, technology roadmap, and competitive landscape.
Based on the latest IndexBox report, an in-depth analysis of the scale, growth drivers, technological shifts, competitive landscape, and trade dependencies of the North American semiconductor materials market. From an industrial chain perspective, the article examines the restructuring of the materials supply chain under the stimulus of the CHIPS Act, highlighting import bottlenecks for high-purity chemicals and advanced photoresists, as well as the certification cycle and cost pressures during the localization process.
Based on a Forbes report, an in-depth analysis of how AI data center construction drives the explosion of memory chip demand, breaks historical cycles, and reshapes the industry chain, competitive landscape, and regional layout.
Sum Technology secured a cleanroom contract from K Test Malaysia before its listing, reflecting deeper trends of expansion in Southeast Asia's semiconductor backend packaging and testing capacity, growing demand for cleanroom equipment, and global supply chain relocation.
Google is discussing with Samsung to produce the I/O Die for its tenth-generation AI chip "Icefish," using Samsung's 2nm process, while the main compute chip will still be manufactured by TSMC's 1.4nm process. This move marks a shift in the AI chip supply chain from sole reliance on TSMC to diversification, having a profound impact on the wafer foundry landscape, advanced packaging technology, and global semiconductor industry competition.
In-depth analysis of the latest IC technologies showcased by Novosense at PCIM Europe 2026, exploring their impact on automotive high-voltage systems, AI data center power supplies, white goods, and industrial control, as well as the rise of Chinese analog chip companies in the global industrial chain.
NVIDIA and TSMC announced that they will apply NVIDIA’s accelerated computing, CUDA-X, cuLitho, cuEST, cuML, Metropolis, TAO, and Omniverse to wafer fabrication and yield optimization. This is not only a corporate partnership, but also reflects how advanced process nodes, advanced packaging, and fab operations are entering the “AI-native manufacturing” stage, and will reshape semiconductor equipment, software, yield management, and the way the industry supply chain competes.
SEMI and Global Net Corp. have released a market report on glass core substrates, noting that AI and HPC are driving the continued evolution of advanced packaging. This article analyzes, from the perspectives of the industrial chain, technological routes, supply chain, and regional competition, why glass substrates are becoming the next battleground in packaging, as well as their medium- to long-term impact on chip design, foundries, equipment and materials, and packaging houses.