Sofia Al-Said provides data-driven insights into the semiconductor market cycle and capital investment trends. She coordinates the publication of industry research and monitors major global chip summits.
Based on the latest IndexBox report, an in-depth analysis of the scale, growth drivers, technological shifts, competitive landscape, and trade dependencies of the North American semiconductor materials market. From an industrial chain perspective, the article examines the restructuring of the materials supply chain under the stimulus of the CHIPS Act, highlighting import bottlenecks for high-purity chemicals and advanced photoresists, as well as the certification cycle and cost pressures during the localization process.
Based on a Forbes report, an in-depth analysis of how AI data center construction drives the explosion of memory chip demand, breaks historical cycles, and reshapes the industry chain, competitive landscape, and regional layout.
Sum Technology secured a cleanroom contract from K Test Malaysia before its listing, reflecting deeper trends of expansion in Southeast Asia's semiconductor backend packaging and testing capacity, growing demand for cleanroom equipment, and global supply chain relocation.
Google is discussing with Samsung to produce the I/O Die for its tenth-generation AI chip "Icefish," using Samsung's 2nm process, while the main compute chip will still be manufactured by TSMC's 1.4nm process. This move marks a shift in the AI chip supply chain from sole reliance on TSMC to diversification, having a profound impact on the wafer foundry landscape, advanced packaging technology, and global semiconductor industry competition.
In-depth analysis of the latest IC technologies showcased by Novosense at PCIM Europe 2026, exploring their impact on automotive high-voltage systems, AI data center power supplies, white goods, and industrial control, as well as the rise of Chinese analog chip companies in the global industrial chain.
NVIDIA and TSMC announced that they will apply NVIDIA’s accelerated computing, CUDA-X, cuLitho, cuEST, cuML, Metropolis, TAO, and Omniverse to wafer fabrication and yield optimization. This is not only a corporate partnership, but also reflects how advanced process nodes, advanced packaging, and fab operations are entering the “AI-native manufacturing” stage, and will reshape semiconductor equipment, software, yield management, and the way the industry supply chain competes.
SEMI and Global Net Corp. have released a market report on glass core substrates, noting that AI and HPC are driving the continued evolution of advanced packaging. This article analyzes, from the perspectives of the industrial chain, technological routes, supply chain, and regional competition, why glass substrates are becoming the next battleground in packaging, as well as their medium- to long-term impact on chip design, foundries, equipment and materials, and packaging houses.